Process	Item	Process Capability	Tolerance
Cut	Max Thickness	3.2mm	——
	Max Size	21.5*24.5"	1%
	Thin Board	0.4mm	10%
Drilling	Min Hole Size	0.3mm	PTH：±3mil
	Max Hole Size	5.05mm	NPTH： ±2mil
	Min Slot Width	0.6mm	——
	Hole Location	3mil	——
	Hole Diameter Registration	1mil	——
Panel Plating	Max Ratio	6:1	±20%
	Min PTH Size	0.3mm	——
	Hole Copper Thickness	1.0mil	±25%
	Panel Copper Thickness	1.2mil	±25%
Pattern Plating	Max Ratio	6:1	——
	Hole Copper Thickness	1.0mil	——
	Pattern Copper Thickness	1.2mil	——
Image Pattern	Min Trace Width/Spacing	5/5mil	——
	Min Land	H/H：5mil	——
		1/1：6mil	——
		2/2：7mil	——
Etch	Min Line Width	5mil	±15%
	Max Copper Thickness	3oz	±15%
V-Cut	Min Board Thickness	0.6mm	——
	Remaining	1/3 Board thickness	——
	Registration Between grooves	——	±0.1mm
	V-cut Spacing	12mm	±8mil
	Registration	0.1mm	——
E-Test	Min Thickness	0.4mm	——
	Max Test Size	650*510mm	——
	Min Spacing Between Points	0.3mm	——
	Min Probe Width	0.18mm	——
	Max Test Points	6144	——
	Test Voltage Scale	50V—300V	——
	Min Insulation Resist	1m/ohms	——
	Max Insulation Resist	100m/ohms	——
Mask Solder	Min Mask Bridge	3mil	——
	Min Ring Cut to Trace	2mil	——
	Min Mask Cut One-side	2mil	——
	Min Mask Thickness	5um	——
	Min Rigidity	6H	——
Legend	Min Registration	6mil	——
	Min Width	6mil	——
	Min Spacing	6mil	——
Profile	Hole to Hole	——	±3mil
	Hole to Side	——	±4mil
	Side to Side	——	±5mil
Surface Treatment	HASL Thickness	70-1000 U"	——
	Lead to Sin	37/63（5%）	——
	OSP Thickness	0.3-0.5um	——
	Immersion Gold	1-5 U"	——
	Immersion Ni	80-300 U"	——
	Immersion Ag & Immersion Sin	20-40 U"	——